Category: Embedded Solution Product of the Year
Winbond’s HyperRAM™ with WLCSP reaches an unprecedented thin form factor in embedded applications.
Cypress first published HyperBus™ technology in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus™ interface is the low pin count, which makes the circuit board layout simpler and the wiring area relatively small. Several IC design service companies have launched HyperBus™ related IP, making it easier for main chip manufacturers to design memory controllers. There are more and more main chip manufacturers whose products support this interface. In response to this trend, Winbond Electronics has successively launched related HyperRAM™ series products.
Comparing the existing 3.0V HyperRAM™ products operating at 100MHz / 200Mbps and 1.8V HyperRAM™ products operating at 166MHz / 333Mbps, Winbond HyperRAM™ 2.0 products can operate at a maximum frequency of 200MHz and provide a maximum data-transfer rate of 400Mbps with either 3.0V or 1.8V operation voltage.
Winbond provides four product lines of 32Mb, 64Mb, 128Mb, and 256Mb for different customer applications in terms of memory density.
In terms of package type, Winbond also provides a variety of options, including:
24-ball, 8mm x 6mm TFBGA for automotive and industrial applications
49-ball, 4mm x 4mm WFBGA for consumer applications
15-ball, 1.48mm x 2mm Wafer Level Chip Scale Package (WLCSP)
Known Good Die (KGD)
Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level instead of assembling individual units in packages after dicing them from a wafer. The key advantages of the WLCSP are the minimum inductance of die to PCB, enhanced thermal conduction, reduced package size, weight and smaller footprint. These characteristics make WLCSP the best solution to meet mobile products’ requirements like cellular phones, smartwatches, and other wearable electronics. Winbond HyperRAM™ series products with WLCSP will be the best memory solution for these applications.