Recently, the demand for “High Power” semiconductor products has been increasing, but chip manufacturers are facing challenges in High Voltage and High Current testing in regards to temperature. ERS therefore introduced the PowerSense© concept in their thermal chuck, which offers an industry-leading ability to actively dissipate wattage during wafer test, on any specific location on the chuck. It has a patented Active Dissipation Control (ADC) which eliminates thermal resistance in the chuck, making it less than 0.1°C/W.
The PowerSense© thermal chuck is expected to alleviate many of the problems faced by HV and HC applications during temperature testing, ultimately enabling an easier and more efficient manufacturing process of “High Power” chips. As the EV market continues to grow, technology such as PowerSense© will be essential to the performance of the new generation of electric cars.